Speed binning for dynamic and adaptive power control

ABSTRACT

A plurality of digital circuits are manufactured from an identical circuit design. A power controller is operatively connect to the digital circuits, and a non-volatile storage medium is operatively connected to the power controller. The digital circuits are classified into different voltage bins, and each of the voltage bins has a current leakage limit. Each of the digital circuits has been previously tested to operate within a corresponding current leakage limit of a corresponding voltage bin into which each of the digital circuits has been classified. The non-volatile storage medium stores boundaries of the voltage bins as speed-binning test data. The power controller controls power-supply signals applied differently for each of the digital circuits based on which bin each of the digital circuit has been classified and the speed-binning test data.

BACKGROUND

The embodiments of the invention generally relate to optimizing powerusage in integrated circuit designs and more particularly to methods anddesigns that sort identical integrated circuit devices into voltage binsand test such integrated circuit devices to ensure that they are withinprescribed current leakage limits for each of the different voltagebins.

Manufacturing variations may cause one or more parameters to varybetween integrated circuits that are formed according to the samedesign. These variations can affect chip operating frequency (i.e.,switching speed). For example, due to variations in the equipment,operators, position on a wafer, etc., a specific parameter may varybetween chips built on the same wafer, chips built on different wafersin the same lot and/or on chips built on different wafers in differentlots. If this parameter is, for example, channel length, width orthreshold voltages, the transistors of each chip may be different suchthat the performance varies (e.g., faster or slower). Chips that arefabricated either at the “slow” end or the “fast” end of a processdistribution (e.g., a process-temperature-variation (PVT) space) may notbe desirable. For example, chips that are fabricated at the “slow” endof such a process distribution may not meet the desired performancespecification (i.e., may not have a fast enough switching speed),whereas chips fabricated at the “fast” end of this process distributionmay exhibit excessive power and leakage current. Thus, it is possible torun faster parts at lower voltage and slower parts at higher voltage, inorder to reduce the maximum power for the distribution of parts. Thedivision between the fast and slow portions of the distribution (i.e.the cutpoint), is generally determined apriori during the design phase.

SUMMARY

According to one embodiment herein, a method of optimizing power usagein an integrated circuit design manufactures integrated circuit devicesaccording to an integrated circuit design using manufacturing equipment.The integrated circuit design produces integrated circuit devices thatare identically designed, but perform at different operating speedscaused by manufacturing process variations. The method sorts theintegrated circuit devices after manufacture into relatively slowintegrated circuit devices and relatively fast integrated circuitdevices to classify the integrated circuit devices into differentvoltage bins. The relatively fast integrated circuit devices consumemore power than the relatively slow integrated circuit devices. Themethod establishes a bin-specific current leakage limit for each of thevoltage bins and tests the current leakage amounts of the integratedcircuit devices using a tester. This allows the method to identify asdefective ones of the integrated circuit devices that exceed thebin-specific integrated circuit current leakage limit of a correspondingvoltage bin into which each of the digital circuits has been classified.The method removes the defective ones of the integrated circuit devicesto allow only non-defective integrated circuit devices to remain andsupplies the non-defective integrated circuit devices to a customer.

According to another embodiment herein, a method of optimizing powerusage in an integrated circuit design manufactures integrated circuitdevices according to an integrated circuit design using manufacturingequipment. The integrated circuit design produces integrated circuitdevices that are identically designed, but perform at differentoperating speeds caused by manufacturing process variations. The methodsorts the integrated circuit devices after manufacture into relativelyslow integrated circuit devices and relatively fast integrated circuitdevices to classify the integrated circuit devices into differentvoltage bins. The relatively fast integrated circuit devices consumemore power than the relatively slow integrated circuit devices. Themethod establishes a bin-specific current leakage limit for each of thevoltage bins and tests the current leakage amounts of the integratedcircuit devices using a tester. This allows the method to identify asdefective ones of the integrated circuit devices that exceed thebin-specific integrated circuit current leakage limit of a correspondingvoltage bin into which each of the digital circuits has been classified.The method removes the defective ones of the integrated circuit devicesto allow only non-defective integrated circuit devices to remain andoperatively connects a plurality of the non-defective integrated circuitdevices to a power controller to create a device.

According to a further embodiment herein, a device comprises a pluralityof digital circuits manufactured from an identical circuit design, apower controller operatively connect to the digital circuits, and anon-volatile storage medium operatively connected to the powercontroller. The digital circuits are classified into different voltagebins, and each of the voltage bins has a current leakage limit. Thenon-volatile storage medium stores boundaries of the voltage bins asspeed-binning test data. The power controller controls power-supplysignals applied differently for each of the digital circuits based onwhich bin each of the digital circuit has been classified and thespeed-binning test data.

According to an additional embodiment herein, a device comprises aplurality of digital circuits manufactured from an identical circuitdesign, a power controller operatively connect to the digital circuits,and a non-volatile storage medium operatively connected to the powercontroller. The digital circuits are classified into different voltagebins, and each of the voltage bins has a current leakage limit. Each ofthe digital circuits has been previously tested to operate within acorresponding current leakage limit of a corresponding voltage bin intowhich each of the digital circuits has been classified. The non-volatilestorage medium stores boundaries of the voltage bins as speed-binningtest data. The power controller controls power-supply signals applieddifferently for each of the digital circuits based on which bin each ofthe digital circuit has been classified and the speed-binning test data.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments herein will be better understood from the followingdetailed description with reference to the drawings, which are notnecessarily drawing to scale and in which:

FIG. 1 is a chart illustrating the relationship between process speedand power usage for integrated circuits manufactured with the sameprocess;

FIG. 2 is a chart illustrating the relationship between process speedand power usage for integrated circuits manufactured with the sameprocess using a 2-bin selective binning process;

FIG. 3 is a chart illustrating the relationship between process speedand power usage for integrated circuits manufactured with the sameprocess using a multi-bin selective binning process;

FIG. 4 is a chart illustrating the cut points of selective voltagebinning;

FIG. 5 is a chart illustrating the current limits of different voltagebins;

FIG. 6 is a flow diagram illustrating a process of using current leakagelimits within a selective voltage binning operation;

FIG. 7 is a flow diagram illustrating a process of using current leakagelimits within a selective voltage binning operation;

FIG. 8 is a schematic diagram of a device containing many integratedcircuit devices that have the sorted into different voltage bins andthat are controlled using a power controller; and

FIG. 9 is a schematic diagram of a hardware system according toembodiments herein.

DETAILED DESCRIPTION

As mentioned above, the process of selective voltage binning can runfaster parts at lower voltage and slower parts at higher voltage, inorder to reduce the maximum power for the distribution of parts.However, conventional selective voltage binning assumes a certainnon-changing performance/current leakage relationship, which may notalways be correct. Indeed, some large variation in current leakage canoccur. Because of this, customers are often advised that the binneddevices may not precisely operate within their specific binclassification and, instead, each is provided with a +/− bin variationrange (e.g., +/−3 bins). The embodiments described below address thisissue and are able to supply binned devices that are guaranteed tooperate within their specific voltage bin (without requiring a binvariation range).

More specifically, the technology and design system development hereinidentifies a bounding performance versus current leakage curve andintegrates such a curve into the power estimation tool. During productdesign, the embodiments herein use the power estimation tool (with thebounding current leakage limit) to calculate current leakage for eachbin at customer use conditions, calculate the total power for each binat customer use conditions, and calculate leakage for each bin at testconditions. During product testing, performance is measured, the leakagescreen for performance is applied and any noncompliant product isscrapped or classified as non-conforming. This provides lower systempower consumption without requiring a bin variation range because theleakage power is guaranteed by the current leakage screening process.This avoids “escapes” and possible system “meltdown.”

FIG. 1 is a chart illustrating the relationship between process speedand power usage for identically manufactured integrated circuit devices.FIG. 2 is a chart illustrating the relationship between process speedand power usage for integrated circuits manufactured with the sameprocess using a 2-bin selective binning process, and FIG. 3 is a chartillustrating the relationship between process speed and power usage forintegrated circuits manufactured with the same process using a multi-binselective binning process.

Post-manufacturing voltage binning is a technique that is used to sortmanufactured chips into bins based on whether they were fabricated ateither the “slow” end or the “fast” end of a process distribution, andto vary the voltage requirements for the chips depending upon the binsthey are assigned to in order to reduce maximum chip power. For example,FIG. 1 is a diagram illustrating the dynamic power and process speed forchips that are manufactured from a common design, but that are differentbecause of different processing conditions that occur within acceptablemanufacturing tolerances.

In FIG. 1, the worst-case process range on curve 100 drives the requiredvoltage for ultimately running the chip, creating an unnecessarily highoperating voltage. However, with selective voltage binning shown inFIGS. 2 and 3, every chip is tested to measure operating speed and thechips are sorted into voltage bins accordingly. This reduces maximumchip power by running fast process chips at lower Vdd, as shown bycurves 102 and 104. Thus, the devices are binned by process, and slowchips are operated at normal Vdd without change to slow-corner voltage,timing, and power (because slow-corner power is not limiting). However,as shown in FIGS. 2-3, fast chips are operated at reduced Vdd becausethe fast chips have speed to spare, and at reduced Vdd, power isreduced.

For example, in a process-voltage-temperature space, the temperature andvoltage of the chip may be fixed and the leakage may be measured. If theleakage is above a specific cut point, then the chip is on the fast endof the process-voltage-temperature space and placed in a fast chip bin.If the leakage is below the cut point, then the chip is on the slow endof the process-voltage-temperature space and placed in a slow chip bin.After the chips are sorted into bins according to the cut point, anoptimal supply voltage (Vdd) for operating the chips in each bin isdetermined. Since both dynamic power consumption and static powerconsumption are exponentially proportional to the Vdd, a reduction inthe required Vdd will reduce both dynamic and leakage power consumptionand, thus, overall power consumption.

In FIG. 4, item 116 represents the selective voltage binning (SVB) cutpoint between what is considered to be a fast device and what isconsidered to be a slow device along curve 114. The fast devices willsorted into the “fast” bin and will be utilized at lower voltages thanthe slow devices that are sorted into the “slow” bin. Because the fastdevices have more leakage, the fast devices will consume more power.

In FIG. 4, item 110 represents the electronic chip identification data(ECID) that will be stored on the chip. Thus, the ECID value is burnedinto the device based on process, the customer reads the ECID (which canbe tied to an input/output (10)) to determine voltage levels on board,and the customer handles setting power supplies differently based uponECID value. Further, timing closure runs are adjusted for SVB. Thus,item 110 defines the “performance sorting ring oscillator” (PSRO)) andcurrent leakage criteria for a particular bin on each part. Part of thisinformation includes the identification of the cut point use by logic112 to supply information to the voltage management unit (voltageregulator). As shown in FIG. 4 the logic 112 can alter the voltage atwhich the specific device operates.

FIG. 5 is a chart of performance (speed) versus leakage current (idd)illustrating the different current leakage limits 120 that are set foreach of the different voltage bins and the scattered data points 130represent the measured current leakage obtained when the devices aretested at operating conditions and at operating temperature. Any devicethat produces current leakage above the bin-specific current leakagelimit is considered unacceptable and is either scrapped or used for adifferent purpose.

FIG. 6 is a box diagram illustrating the overall logical operation ofthe various methods and devices herein. In FIG. 6, item 140 represents asystem that is used to develop technology and product design and thissystem 140 is used to identify the bounding performance/leakage limitsfor a given technology and library 142. Such limits 142 are supplied toa power estimation tool 144. For a specific design product 146, thepower estimation tool 144 is used to apply the selective voltage binningat system conditions in a power estimation process 148.

In item 152, the product is tested and this establishes the leakagelimit for each bin 154 and this information is used to identify theleakage at test temperature 150. The current leakage limits 154 andtested current leakage 150 are used in the system design 158 such thatthe selective voltage binning can be applied without any bin uncertainty(item 160). Therefore, by setting the leakage limit for each bin 154 andeliminating unacceptable devices, the embodiments herein provide aproduct test interlock to the system design 156 that eliminates binuncertainty.

FIG. 7 is a flow diagram illustrating an exemplary method herein thatoptimizes power usage in an integrated circuit design. In item 200 thisexemplary method manufactures integrated circuit devices according to anintegrated circuit design using manufacturing equipment. The integratedcircuit design produces integrated circuit devices that are identicallydesigned, but perform at different operating speeds caused bymanufacturing process variations.

In item 202 this exemplary method divides the integrated circuit devicesafter manufacture into relatively slow integrated circuit devices andrelatively fast integrated circuit devices to classify the integratedcircuit devices into different voltage bins. The relatively fastintegrated circuit devices consume more power than the relatively slowintegrated circuit devices. When establishing the limits for thedifferent voltage bins, the limits are established such that therelatively slow integrated circuit devices and relatively fastintegrated circuit devices to consume a same maximum power.

In item 204 this exemplary method establishes a bin-specific currentleakage limit for each of the voltage bins and tests the current leakageamounts of the integrated circuit devices using a tester in item 206.This allows the method to identify as defective ones of the integratedcircuit devices that exceed the bin-specific integrated circuit currentleakage limit of a corresponding voltage bin into which each of thedigital circuits has been classified in item 208. The method removes thedefective ones of the integrated circuit devices in item 210 to allowonly non-defective integrated circuit devices to remain. Thesenon-defective integrated circuit devices can be supplied to a customer(item 212) or a plurality of the non-defective integrated circuitdevices can be operatively connected to a power controller to create adevice (item 214).

FIG. 8 illustrates an additional embodiment herein which is a device 240that comprises a plurality of digital circuits 250 manufactured from anidentical circuit design, a power controller 260 operatively connect tothe digital circuits, and a non-volatile storage medium 252 operativelyconnected to the power controller 260. In this example all the digitalcircuits 250 are application specific integrated circuits (ASIC);however, as would be understood by those ordinarily skilled in the art,any device could be used with the embodiments herein. As mentionedabove, the digital circuits 250 are classified into different voltagebins, and each of the voltage bins has a current leakage limit. Each ofthe digital circuits 250 has been previously tested to operate within acorresponding current leakage limit of a corresponding voltage bin intowhich each of the digital circuits has been classified.

The non-volatile storage medium 252 stores boundaries of the voltagebins as speed-binning test data. The power controller 260 controlspower-supply signals applied differently for each of the digitalcircuits 250 based on which bin each of the digital circuit has beenclassified and the speed-binning test data.

The speed-binning test data has been generated and stored in thenon-volatile storage medium 252 during production testing of the digitalcircuits. The non-volatile storage medium 252 can comprise, for example,a programmable fuse block. The power controller 260 determines a speedconstraint for a task to be executed by a given digital circuit 250based on a voltage bin to which the digital circuit has been classified,and the power controller 260 also specifies levels of the power-supplysignals for execution of the task based on such a speed constraint. Someembodiments can also include a sensor 254 that senses the temperature ofa given digital circuit, and the current leakage testing is performedonly within a temperature operating range of the digital circuit.Additional embodiments can also include a power management unit (PMU)270 that receives instructions from the power controller 260 regardinglevels of the power-supply signals and generates the power-supplysignals based on the instructions.

A representative hardware environment for practicing the embodimentsherein is depicted in FIG. 9. This schematic drawing illustrates ahardware configuration of an information handling/computer system inaccordance with the embodiments herein. The system comprises at leastone processor or central processing unit (CPU) 10. The CPUs 10 areinterconnected via system bus 12 to various devices such as a randomaccess memory (RAM) 14, read-only memory (ROM) 16, and an input/output(I/O) adapter 18. The I/O adapter 18 can connect to peripheral devices,such as disk units 11 and tape drives 13, or other program storagedevices that are readable by the system. The system can read theinventive instructions on the program storage devices and follow theseinstructions to execute the methodology of the embodiments herein. Thesystem further includes a user interface adapter 19 that connects akeyboard 15, mouse 17, speaker 24, microphone 22, and/or other userinterface devices such as a touch screen device (not shown) to the bus12 to gather user input. Additionally, a communication adapter 20connects the bus 12 to a data processing network 25, and a displayadapter 21 connects the bus 12 to a display device 23 which may beembodied as an output device such as a monitor, printer, or transmitter,for example.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods and computer program products according to variousembodiments herein. In this regard, each block in the flowchart or blockdiagrams may represent a module, segment, or portion of code, whichcomprises one or more executable instructions for implementing thespecified logical function(s). It should also be noted that, in somealternative implementations, the functions noted in the block may occurout of the order noted in the figures. For example, two blocks shown insuccession may, in fact, be executed substantially concurrently, or theblocks may sometimes be executed in the reverse order, depending uponthe functionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts, or combinations of special purpose hardware andcomputer instructions.

The method as described above is used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of this disclosure.As used herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises”and/or “comprising,” when used in this specification, specify thepresence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

The corresponding structures, materials, acts, and equivalents of allmeans or step plus function elements in the claims below are intended toinclude any structure, material, or act for performing the function incombination with other claimed elements as specifically claimed. Thedescriptions of the various embodiments of the present invention havebeen presented for purposes of illustration, but are not intended to beexhaustive or limited to the embodiments disclosed. Many modificationsand variations will be apparent to those of ordinary skill in the artwithout departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdisclosed herein.

What is claimed is:
 1. A method of optimizing power usage in anintegrated circuit design, said method comprising: manufacturingintegrated circuit devices according to an integrated circuit designusing manufacturing equipment, said integrated circuit design producingintegrated circuit devices that are identically designed and perform atdifferent operating speeds caused by manufacturing process variations;sorting said integrated circuit devices after manufacture intorelatively slow integrated circuit devices and relatively fastintegrated circuit devices to classify said integrated circuit devicesinto different voltage bins, said relatively fast integrated circuitdevices consuming more power than said relatively slow integratedcircuit devices, establishing a bin-specific current leakage limit foreach of said voltage bins; testing current leakage amounts of saidintegrated circuit devices using a tester; identifying as defective onesof said integrated circuit devices that exceed said bin-specificintegrated circuit current leakage limit of a corresponding voltage bininto which each of said digital circuits has been classified; removingsaid defective ones of said integrated circuit devices to allow onlynon-defective integrated circuit devices to remain; and supplying saidnon-defective integrated circuit devices to a customer.
 2. The method ofclaim 1, further comprising establishing limits for said differentvoltage bins such that said relatively slow integrated circuit devicesand relatively fast integrated circuit devices to consume a same maximumpower.
 3. The method of claim 1, further comprising embedding binidentification in said integrated circuit devices.
 4. The method ofclaim 3, further comprising: reading said bin identification using apower controller operatively connected to said integrated circuitdevices; determining a speed constraint for a task to be executed by adigital circuit based on a voltage bin to which said digital circuit hasbeen classified using said power controller; and specifying levels ofsaid power-supply signals for execution of said task based on said speedconstraint using said power controller.
 5. The method of claim 1,further comprising, during said testing, sensing a temperature of adigital circuit using a sensor and performing said testing only within atemperature operating range of said digital circuit.
 6. The method ofclaim 1, said establishing of said bin-specific current leakage limitcomprising design limits and limits based on empirical testing atoperating conditions.
 7. A method of optimizing power usage in anintegrated circuit design, said method comprising: manufacturingintegrated circuit devices according to an integrated circuit designusing manufacturing equipment, said integrated circuit design producingintegrated circuit devices that are identically designed and perform atdifferent operating speeds caused by manufacturing process variations;sorting said integrated circuit devices after manufacture intorelatively slow integrated circuit devices and relatively fastintegrated circuit devices to classify said integrated circuit devicesinto different voltage bins, said relatively fast integrated circuitdevices consuming more power than said relatively slow integratedcircuit devices, establishing a bin-specific current leakage limit foreach of said voltage bins; testing current leakage amounts of saidintegrated circuit devices using a tester; identifying as defective onesof said integrated circuit devices that exceed said bin-specificintegrated circuit current leakage limit of a corresponding voltage bininto which each of said digital circuits has been classified; removingsaid defective ones of said integrated circuit devices to allow onlynon-defective integrated circuit devices to remain; and operativelyconnecting a plurality of said non-defective integrated circuit devicesto a power controller to create a device.
 8. The method of claim 7,further comprising establishing limits for said different voltage binssuch that said relatively slow integrated circuit devices and relativelyfast integrated circuit devices to consume a same maximum power.
 9. Themethod of claim 7, further comprising embedding bin identification insaid integrated circuit devices.
 10. The method of claim 9, furthercomprising: reading said bin identification using said power controller;determining a speed constraint for a task to be executed by a digitalcircuit based on a voltage bin to which said digital circuit has beenclassified using said power controller; and specifying levels of saidpower-supply signals for execution of said task based on said speedconstraint using said power controller.
 11. The method of claim 7,further comprising, during said testing, sensing a temperature of adigital circuit using a sensor and performing said testing only within atemperature operating range of said digital circuit.
 12. The method ofclaim 7, said establishing of said bin-specific current leakage limitcomprising design limits and limits based on empirical testing atoperating conditions.
 13. A device comprising: a plurality of digitalcircuits manufactured from an identical circuit design; a powercontroller operatively connect to said digital circuits; and anon-volatile storage medium operatively connected to said powercontroller, said digital circuits being classified into differentvoltage bins, each of said voltage bins having a current leakage limit,said non-volatile storage medium storing boundaries of said voltage binsas speed-binning test data, and said power controller controllingpower-supply signals applied differently for each of said digitalcircuits based on which bin each of said digital circuit has beenclassified and said speed-binning test data.
 14. The device of claim 13,said speed-binning test data having been generated and stored in saidnon-volatile storage medium during production testing of said digitalcircuits.
 15. The device of claim 13, said non-volatile storage mediumcomprising a one-time programmable (OTP) fuse block.
 16. The device ofclaim 13, wherein said power controller determines a speed constraintfor a task to be executed by a digital circuit based on a voltage bin towhich said digital circuit has been classified, and said powercontroller specifies levels of said power-supply signals for executionof said task based on said speed constraint.
 17. The device of claim 13,further comprising a sensor that senses temperature of a digitalcircuit, testing of current leakage being performed only within atemperature operating range of said digital circuit.
 18. The device ofclaim 13, said current leakage limit comprising design limits and limitsbased on empirical testing at operating conditions.
 19. A devicecomprising: a plurality of digital circuits manufactured from anidentical circuit design; a power controller operatively connect to saiddigital circuits; and a non-volatile storage medium operativelyconnected to said power controller, said digital circuits beingclassified into different voltage bins, each of said voltage bins havinga current leakage limit, each of said digital circuits being previouslytested to operate within a corresponding current leakage limit of acorresponding voltage bin into which each of said digital circuits hasbeen classified, said non-volatile storage medium storing boundaries ofsaid voltage bins as speed-binning test data, and said power controllercontrolling power-supply signals applied differently for each of saiddigital circuits based on which bin each of said digital circuit hasbeen classified and said speed-binning test data.
 20. The device ofclaim 19, said speed-binning test data having been generated and storedin said non-volatile storage medium during production testing of saiddigital circuits.
 21. The device of claim 19, said non-volatile storagemedium comprising a one-time programmable (OTP) fuse block.
 22. Thedevice of claim 19, wherein said power controller determines a speedconstraint for a task to be executed by a digital circuit based on avoltage bin to which said digital circuit has been classified, and saidpower controller specifies levels of said power-supply signals forexecution of said task based on said speed constraint.
 23. The device ofclaim 19, further comprising a sensor that senses temperature of adigital circuit, testing of current leakage being performed only withina temperature operating range of said digital circuit.
 24. The device ofclaim 19, said current leakage limit comprising design limits and limitsbased on empirical testing at operating conditions.